1774454700 homsunic
Username: Password:
 Part Search
 Hot Products
XC5VLX110-FFG1153 84716
AD50800 8093
EP1S25F780C7N 801057
FHX13X 2801
ADSP-TS101S-AB1Z-1 8011
Q1900C-1N 80132
D249548P 62916
xc3020-70 55716
DAC-HZ12DGC 5141
AD202JN98+ 4438
ADSP2100AKG9925 4816
MO603N360J050T 3358
LXT400PE 22316
AM7990JC-80 112801
ICE2A180Z 3573
MT7920 11143563216
MAG3110 11143561016
32Mx32 GDDR3 11143553116
h5gq1h24afr 11143551916
fl817 11143543516
Breakthrough speed, interconnection barriers, the latest system-level packaging technology of NEC shock stage.
Accesses the net the time: On August 8, 2006
Article origin: Electronic engineering special edition
NEC Corporation announced one kind of new system level seal (SiP) the technology, and declares its may in the sole seal the storehouse logic and lucky compared to the top grade memory, thus realizes high velocity high sharp image processing on the mobile equipment. NEC pointed out that, this item of named SMAFTI technology uses the three dimensional chip connection, has about 60 micron slits and 50 micron spacings micro spots between the logic and the storage device, can support reaches as high as the 100Gb each second transmission speed. The designer if and other has the strict limit in the handset to the size and the power in the portable equipment to use the Smafti technology, will be allowed to realize can the resolution which will compare favorably with with the high clear television. NEC advanced equipment development enterprise department General Manager Takaaki Kuwata indicated that, "The portable expense class equipment regarding the digital video frequency television, the digital video frequency game and other digital video frequency functions intense demands, is impelling to have the quartz high is clear (crystal-clear) the high speed picture processing need." Takaaki pointed out that, "The system level chip (SOC) the technology has the insufficiency in the development cost and the memory capacity, but traditional SiP product then because of 转接板thicker causes the seal to be bigger, and in the signalling speed, the wiring interlocks the nature and the chip arranges abreast in row on has the limitation. The new Smafti technology successfully has solved these problems, and causes engineer to be allowed highly effective to design and to produce uses in to move the electronic installation the high performance system. NEC discloses said that, the Smafti technology is uses three kind of essential technical developments to become: 50 microns spacings micro spots interlock the technology, the connection performance outstanding 15 microns thick lead pass 转接板the technology, as well as multi- pieces assembly technology. NEC indicated, based on Smafti technology product hopefully in 2007 first quarter period is published by each kind of size non- lead seal form.
© 2007-2011 Copyright HOMSUN TECHNOLOGY (HK) LIMITED All rights reserved
Tel:86-755-82533644  Fax:86-755-82537669
Car Diagnostic Tools
Autocom CDP+
Bluetooth keyboard